Limab

Product

PanelProfiler

BMS3000 non contact panel thickness measuring system BMS3000 panel thickness measuring system operator screen

Overview

The Panel Profiler is a non contact laser based system designed for measuring the thickness of panels in-process during manufacture. It is suitable for all type of panel products such as MDF, OSB,  chipboard, hardboard, HPL, plywood, rigid foam insulation panels and many other types of panel products.

Quick Spec

Number of tracks Thickness range Resolution Measuring Rate
1 - 24 0.1 - 200 mm 0.01 mm 2000 Hz

Operating Principle

The thickness is measured by a pair (or pairs) of PreciCura sensors which use the principle of optical laser triangulation and measure directly to almost any material or surface. They are connected together in differential thickness mode. Multiple sensors are used to measure at different locations across the width of the panel.

Applications

  • Thickness profile of MDF, OSB, PB board at the exit of a continuous press
  • Thickness profile of MDF, OSB, PB board after the exit of a multi opening press
  • Board thickness on entry to sanding machine
  • Final board thickness at the exit of the sander
  • Non contact thickness measurement of cement based panels
  • On-line thickness measurement of insulation materials
  • Thickness measurement of plywood during manufacturing process
  • Non contact thickness of fire retardant panels
  • Non contact thickness of rigid foam insulation panels